Intel debuts second-generation SDV chip at Auto Shanghai 2025
Intel used Auto Shanghai 2025 to debut its second-generation AI-enhanced system-on-chip (SoC) for software-defined vehicles (SDVs). This new SoC is the first in the automotive sector to use a multi-process node chiplet architecture. It is designed to deliver scalable performance, enhanced artificial intelligence capabilities, and cost optimization for automakers. The chiplet-based design allows car manufacturers … Read more