Intel debuts second-generation SDV chip at Auto Shanghai 2025

Intel used Auto Shanghai 2025 to debut its second-generation AI-enhanced system-on-chip (SoC) for software-defined vehicles (SDVs). This new SoC is the first in the automotive sector to use a multi-process node chiplet architecture. It is designed to deliver scalable performance, enhanced artificial intelligence capabilities, and cost optimization for automakers.

The chiplet-based design allows car manufacturers to configure computing, graphics, and AI functions according to specific vehicle requirements. Intel claims this architecture can deliver up to 10 times the AI performance and up to three times the graphics performance compared to previous iterations. The SoC also supports up to 12 camera inputs for enhanced image processing.

Alongside the product launch, Intel announced new collaborations with automotive firms ModelBest and Black Sesame Technologies. ModelBest is working with Intel to enable offline, AI-enhanced voice control using a local large language model, supported by Intel’s SDV SoC and Arc graphics. The goal is to improve voice-based user interaction in vehicle cockpits, without relying on network connectivity.

Black Sesame Technologies is combining its autonomous driving systems with Intel’s new chip and graphics to build a central computing platform. This platform aims to integrate advanced driver-assistance systems (ADAS) with cockpit functionality while maintaining energy efficiency and low latency.

These developments expand Intel’s partnerships in the automotive sector and are part of the company’s broader effort to support intelligent and connected vehicle platforms.